A Thin-Film Heat Flux Sensor Fabricated on Copper for Heat Transfer Measurements in Parallel Channel Heat Sinks
File(s)
Date
2010-05-05Author
Jasperson, Benjamin A.
Pfefferkorn, Frank E.
Qu, Weilin
Turner, Kevin T.
Publisher
5th International Conference on MicroManufacturing (ICOMM 2010)
Metadata
Show full item recordAbstract
A combination of lithography-based microfabrication and micro end milling is used to manufacture thin-film resistance temperature detector (RTD) heat flux sensors on bulk copper substrates. The fabrication process uses photoresist patterning, metal deposition, and lift-off to build the sensor and micro-end milling to segment the sensors. Micro end milling tests were performed to establish determine the optimum conditions for sensor removal which minimized delamination and burr formation. It was determined that starting on the backside (opposite the sensor) of the copper wafer and machining through to the thin film layers resulted in the least amount of burr formation.
Subject
copper substrate
heat flux
thin film sensor
Permanent Link
http://digital.library.wisc.edu/1793/65527Citation
ICOMM 2010 No. 73
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