Heterogeneous integration: From substrate technology to active packaging
File(s)
Date
2001Author
Brown, April S.
Jokerst, Nan Marie
Doolittle, Alan
Brooke, Martin
Kuech, Thomas F.
Seo, Sang-Woo
Kang, Sangbeom
Huang, Sa
Shen, Jeng-Jung
Publisher
Institute of Electrical and Electronics Engineers Inc
Metadata
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http://digital.library.wisc.edu/1793/10620Related Material/Data
http://www.ieee.org/http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000245
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Citation
Brown, A. S., Nan, J. Marie, D., Alan, B., Martin, K., Thomas F., Seo, S.W., et al. (2001). Heterogeneous integration: From substrate technology to active packaging. In IEEE International Electron Devices Meeting IEDM 2001, Dec 2-5 2001, , 197-200.