Heterogeneous integration: From substrate technology to active packaging

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Author(s): Brown, April S.; Jokerst, Nan Marie; Doolittle, Alan; Brooke, Martin; Kuech, Thomas F.; Seo, Sang-Woo; Kang, Sangbeom; Huang, Sa; Shen, Jeng-Jung
Citation: Brown, A. S., Nan, J. Marie, D., Alan, B., Martin, K., Thomas F., Seo, S.W., et al. (2001). Heterogeneous integration: From substrate technology to active packaging. In IEEE International Electron Devices Meeting IEDM 2001, Dec 2-5 2001, , 197-200.
Date: 2001
Part of: http://www.ieee.org/; http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1000245
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Permanent URI: http://digital.library.wisc.edu/1793/10620
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