Stress and Deformation Analysis at the Micro-Scale
Date
2014-03-25Author
Korsunsky, Alexander M.
Publisher
9th International Conference on MicroManufacturing (ICOMM 2014)
Metadata
Show full item recordAbstract
Improving the structural integrity of microstructured materials relies on the combination of advancements in modeling capability and spatially resolved experimental characterization of deformation and damage. We report the recent advancements in the use of synchrotron X-ray diffraction techniques, as well as in the methods utilizing
micro-scale material removal in combination with scanning electron microscopy and digital image correlation for relief strain measurement and stress evaluation.
Subject
digital image correlation
residual stress
diffraction
x-ray
focused ion beam
electron microscopy
Permanent Link
http://digital.library.wisc.edu/1793/68780Citation
ICOMM 2014 No. 88
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