Electrochemical Polishing of Microcomponents
Date
2013-03-25Author
Berestovskyi, Dmytro
Soriaga, Manuel
Lomeli, Paul
James, Jon
Sessions, Brennon
Xiao, Han
Hung, Wayne
Publisher
8th International Conference on MicroManufacturing (ICOMM 2013)
Metadata
Show full item recordAbstract
Microcomponents can be fabricated by traditional
methods like micromilling/drilling, or by nontraditional
methods like electrical discharge micromachining
(EDM), laser micromachining, or electrochemical
micromachining (ECM). These methods, however, often
leave detrimental residual defects like sharp burrs, cracks
in heat affected zones, in addition to rough surface finish.
Electrochemical polishing (ECP) offers a non-contact
technique to remove surface defects such as burrs,
rolling/grinding/machining marks regardless of
component size. This study develops an ECM/ECP
technique to fabricate or polish microcomponents, and
implements this technique to polish copper, titanium, and
stainless steel microcomponents fabricated by EDM and
micromilling. Assessment is made by optical
microscopy, electron microscopy, atomic force
microscopy, and interferometry. Burrs and surface
defects of the tested microcomponents are effectively
removed by ECP. Surface finish of polished surfaces of
polycrystalline titanium, copper, and stainless steels is in
the range of 100-300 nm Ra on polycrystalline surface
and 1-10 nm Ra within a single grain.
Subject
deburring
micromachining
polishing
electrochemical
Permanent Link
http://digital.library.wisc.edu/1793/65395Citation
ICOMM 2013 No. 88