The effects of plasma exposure on the time-dependent dielectric breakdown of low-k porous organosilicate glass
Abstract
Time-dependent dielectric breakdown (TDDB) is a major concern for low-k
organosilicate (SiCOH) dielectrics. To examine the effect of plasma exposure on TDDB
degradation, time-to-breakdown measurements were made on porous SiCOH before and
after exposure to a variety of plasma exposure conditions. A capillary-array window was
used to separate charged particle and photon bombardment. Samples exposed to full
plasma conditions exhibit significant degradation in breakdown times. However, samples
exposed only to VUV photons also show marked TDDB deterioration, suggesting that a
confluence of photon and ion damage effects may be responsible for time dependent
breakdown.